Semiconductor and Electronics
SOLDER PRODUCTS
- Demand for lead-free solder has increased dramatically since the 2006 restriction came into effect for leaded consumer electronics
- Ovitech partnership with Shenzen JF solder company in technology application and cost-effective premium quality solder ball, flux, paste, and nanopowder
Cost Effective Premium Solder Ball
- Main elemental composition: Tin (Sn) 96.5, silver (Ag) 3.0, copper (Cu) 0.5;
- Alloy density: 7.4g/cm3 ( 20℃);
- Solid state to liquid state temperatures: 217℃～219℃;
- Solder Stable Temperature : 300℃+10℃/-0℃;
- Anti-oxidation properties
- Always remain silvery-white
- Phosphorus free
Highly Uniform (HU) Solder Paste for Mini Led
- High sphericity of tin powder & concentrated particle size
- Long stencil printing life (>10h)
- Good shear strength for solder joint and high reliability
- Low voids
- Excellent void performance after reflow
- Low and clear residue of solder paste flux. The residue and substrates metal do not change color or have an impact on the LED’s luminous quality after being placed in a constant temperature chamber at 40°C for 240 hours.
- High thermal and electrical conductivity, the thermal conductivity of SAC305 alloy is about 54W/ m·K.
- Good thixotropy, good dispersion, and the optimum viscosity needed for curing and printing
- Follow the recommended reflow profile parameter setting, it will benefit for soldering and reduce die tilt & die shift issue.
- The cost of curing solder paste is much lower than silver glue and Au80Sn20 alloy, and the curing process saves energy.
- The particle size is 5-15μm for No.6 powder, 2-12μm for No.7 powder
Ultrafine Solder Powder
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*Passed SGS test, RoHS, REACH and other Certifications
Low Alpha Solder Powder
Column Grid Array and
Sn Columns
Cu Columns
Micro Coil Spring
