Sapphire Wafer Chemicals

Ovitech chemical products are developed for the whole process of Sapphire Wafer production

Sapphire polishing slurry can be applied to sapphire wafer which is for LED or camera lens and windows of mobile, by the excellent grinding capacity.

The picture below indicates crystal structure of sapphire. C-Plain is used for GaN LED board and camera lens in mobile. R-Plain is for semiconductor board, A-Plain is being developed for front window of mobile and C-Plain type is also under consideration.

The adhesive is for the grinding sapphire wafer process. After lapping and annealing processes, Back side of wafer is coated with the adhesive and dried by hot-air, and then bonded to alumina plate. The product is used for preventing wafer from being separated from alumina plate. Our adhesive eliminates the problem of wafer detach by friction heat even under harsh condition, and the main ingredient is a modified rosin which has high acid value(185~205).

The high acid value accelerates saponification by alkaline detergent water and which makes the soluble metallic salt  easily soluble in water. From the feature, the product is very helpful to skip the process using IPA(Isoprophylene alcohol) to remove adhesive.