Address

1 Tampines North Drive 1 #02-36
T-Space Building Singapore 528559

Phone

+ 65 98551572

Email

tech@ovitechcorp.com

Semiconductor and Electronics

DIRECT AND INDIRECT MATERIALS

Die Attach Film

Process Automation
  • Wafer Dicing Attach Tape (DAF Tape, WBL)
  • UV curing type
  • Thermal curing type, high adhesive strength
  • Expandable type

Die Attach Paste

We offer some of the most advanced Die Attach paste adhesives engineered to improve long-term reliability, rapid inline curing, long pot-life, viscosity and thixotropic control for fast automated dispensing and manufacturing.

Electrically Conductive Paste Adhesives

Electrically Conductive Paste Adhesives

    • One or two part component
    • Stress free-Substrate/component
    • Large area die attach
    • Solder replacement
    • Ideal for mismatched CTE’s
    • Designed to eliminate bleeding
    • Moisture resistant
    • Fine pitch
    • Rapid curing
Electrically Conductive Paste Adhesives
    • One or two part component
    • Stress free-Substrate/component
    • Large area die attach
    • High Power Die Attach
    • Diamond Filled (custom made)
    • Fast curing
    • Rapid curing

Dicing Tapes

Types of Dicing Adhesive Tape
  • Wafer Dicing Tape
  • UV or Non-UV uring type
  • Improved back side chipping, contamination
  • Expandable type
ITEM

Thickness


Adhesive Strength (gf/25mm)


Base Film Characteristics
AUD1
90um
80(10)
PVC / Normal wafer Saving
AUD5G
90um
80(7)
PVC / CIS (CMOS image sensor)
AUD7
90um
120(13)
PVC /Small size chip (under 2mm)
AUD8
90um
200(8)
PVC /Small size chip (under 2mm)
AUF3
90um
1000(8)
PO / PCB Sawing
AU105-HA
105um
550(12)
PO / Wafer Sawing Glass protect
ADP3
85um
110
PO / No change in adhesion over time
*.() Refers to adhesive strength after UV,

Backgrind Tapes

Types of Back Grind Adhesive Tape
  • Wafer Back Grinding tape
  • Improving TTV Value
  • Prevent Dust and Wafer Penetration
  • Absorbs Mechanical stress
ITEM

Thickness


Adhesive Strength(gf/25mm)


Base film / Characteristics
ABP1
130um
100
PVC / Normal wafer BackGrinding
ABP3
150um
150
PVC /Small size chip (under 2mm)
ABP5
90um
110(13)
PET / Excellent Total Thickness Variation
AP205
250um
150
PVC /Small size chip (under 2mm)
AU130-SC
130um
330(30)
PO / Normal wafer BackGrinding
AUB4
130um
1,000(20)
PVC /Small size chip (under 2mm)
AUDBG
125um
1,200(6)
PET / SDBG process
AU200-SD
200um
1,900(30)
PET / Flip Chip (Cu-pillar type Bump)
AU340-HB

340um
1,700(20)
PET / Flip Chip (Cu-pillar type Bump)
*.() Refers to adhesive strength after UV,

Package Dicing Adhesive Tapes

Types of Dicing Adhesive Tape
  • Package Dicing tape
  • UV curing type
  • Improved back side chipping, contamination by water
  • Higher Adhesive tape for Package Dicing Application
ITEM

Thickness


Adhesive Strength(gf/25mm)


Base film / Characteristics
AU115-HC
115㎛
1400(27)
PO / Small PKG sawing
AU165-HC
165㎛
1900(30)
PO / Small PKG sawing
ABP5
90um
110(13)
PET / Excellent Total Thickness Variation
AU170-HC
170㎛
1800(30)

PO / Normal PKG sawing
AUP1
175㎛
2200(40)
PO / Power QFN Package
AUP4
170㎛
1900(30)
PO / No odor after UV, Small PKG sawing
AUP8
170㎛
900(13)
PO / Anti-static, Small PKG sawing
AUG2
150㎛
1800(10)
PET / Glass sawing
AUG4

125㎛
3800(10)
PET / Glass sawing
AUG5

125㎛
1900(10)
PET / Glass sawing
*.() Refers to adhesive strength after UV,

Bonding Wire Product

Bare Metal Line Up
Gold Bonding Wire

 

High Performance 4N (IU / UB) Broad Bonding Window & High UPH
High Strength 4N (UL / UN) Excellent Looping & T/C
2N Gold (R/UP) Excellent Reliability
Copper Bonding Wire

 

High ority Copper Wire (BC) High Conductivity & Cost Advantage
Alloyed Copper Wire (CA) Better Workability & Realibility for Automotive
Silver Bonding Wire

 

Ag > 96% Alloy Wire (SI) High Conductivity
Ag 94 ~ 96% Alloy Wire (SN / SR) High Reliability & Workability
Metal Coating Wire (ACA) Gas Free Bonding & Low Cost than Gold
Aluminum Bonding Wire

 

Corrosion Resistant Aluminum  Wire (AN) Corrosion Resistance Excellent Clean Surface
Wide Properties Aluminum Wire (AH) Stable Looping Performance Excellent Clean Surface

Metal Coated Copper (cu) Wire

Products
Core Material

Coated Material

Characteristics

Protection Gas


PC




4N Copper


Palladium

  • Better Workability and Reliability Compare to Bare Cu Wire
  • Longer Floor Life than Bare Cu Wire

APC

4N Copper

Palladium, Gold

  • Excellent Workability
  • High Reliability


Available with N2. But recommended 5% Hydrogen Mixed for FAB Uniformity

TS

4N Copper

Palladium, Gold

  • Outstanding Looping Performance


HAP


2N, 3N Copper


Palladium, Gold

  • Alloyed Cu Cored + Multi Metal Coated = Hybrid
  • Excellent Reliability for Automative

Heavy Aluminum (AI) Wire

Products
Core Material

Characteristics

Bonding Method



AN



Ni doped Aluminum

  • Enhanced Corrosion Stability
  • Constant Wedge bond-ability
  • Stable Physical Properties



Wedge bonding
Wire Diameter
:4 ~ 20mil



AH



Pure Aluminum

  • Wide Properties Range
  • Stable Looping Performance
  • Excellent Clean Surface