Semiconductor and Electronics
ORGANIC LAMINATE SUBSTRATE
IC Substrate Company
Our Principal is an all-round IC substrate services from R&D, design, production to testing, covering BT and ABF substrates. Applicable products include Coreless, ETS, FCCSP, FCBGA(BT) and FCBGA(ABF). As the substrate is the key material for the communication between the chip and the circuit board, and the chip design is constantly challenging the limit of Moore’s Law and the demand for chips in the automotive electronics market is constantly expanding, how to achieve high precision, high quality, high reliability and mass production of IC substrates is very important.
FC-CSP
In order to meet the design requirements of new generation chips such as smart phones and other portable smart products, consumer electronics products, 5G related applications, high pin count, good electrical requirements, etc., apart from the traditional Build-up process, Coreless also provides a non-core carrier board and an embedded circuit ETS carrier board, providing flexible layer selection and thin circuit products.
- FCCSP – ETS Substrate
- FCCSP – Coreless
- FCCSP – Build Up
FC-BGA
I/O leads of FC-BGA package can be arrayed on the surface of the chip, which not only has higher density I/O arrangement, but also has the advantages of low loss, low inductance, low electromagnetic interference, etc. Core akg can also provide ABF or BT base FCBGA carrier for customers to have more choices
- FCCSP – Coreless
- FCCSP – Build Up