SOLDER PRODUCTS

Demand for lead-free solder has increased dramatically since the 2006 restriction came into effect for leaded consumer electronics

Ovitech partnership with Shenzen JF solder company in technology application and cost-effective premium quality solder ball, flux, paste, and nanopowder

High sphericity of tin powder & concentrated particle size
Long stencil printing life (>10h)
Good shear strength for solder joint and high reliability
Low voids
Excellent void performance after reflow
Low and clear residue of solder paste flux. The residue and substrates metal do not change color or have an impact on the LED’s luminous quality after being placed in a constant temperature chamber at 40°C for 240 hours.
High thermal and electrical conductivity, the thermal conductivity of SAC305 alloy is about 54W/ m·K.
Good thixotropy, good dispersion, and the optimum viscosity needed for curing and printing
Follow the recommended reflow profile parameter setting, it will benefit for soldering and reduce die tilt & die shift issue.
The cost of curing solder paste is much lower than silver glue and Au80Sn20 alloy, and the curing process saves energy.
The particle size is 5-15μm for No.6 powder, 2-12μm for No.7 powder

Application Characteristics	IPC Alloyed Powder Type	Size of Alloyed Powder
Standard Printing	No. 3 powder	25 ~ 45um
Fine-Pitch Printing	No. 4 powder	20 ~ 38um
Instillation	No. 3 powder	25 ~ 45um
Standard printing	No. 6 powder	5-15um
Standard printing	No. 7 powder	2-11um